Picture of Aligner DUV EVG
Current status:
AVAILABLE
Book | Log
Show/Collapse all

1st Responsible:
2nd Responsible:
You must be logged in to view files.

TECHNICAL SPECIFICATIONS

APPLICATIONS

Resolution

Vacuum = 0.8 µm

Hard Contact = 1.5 µm

Soft Contact = 2.0 µm

Proximity ≥ 5.0 µm

Top and bottom side alignments

Up to 6 inch wafers

For whole substrates and small pieces (≥ 7x7mm²)

Proximity spacer to avoid sticking phenomenon with LN

Glass and flexible masks

Wafers up to 1 mm thick

Alignment stage

Autofocus and automatic positioning / manual precision micrometers

Alignment accuracy

Top side alignment: ± 1.0µm

Bottom side alignment: ± 1.25µm

Substrate size

2”, 3” and 4” and small pieces (≥ 7x7 mm²)

Thickness: 0.1 to 1 mm (more on demand)

Mask size

4” and 5” glass and 5” flexible film

Mask design

GDSII file: utile.gds (to be downloaded from the clean room website)

Exposure

Broadband (mercury arc lamp: 500 W)

Long pass filter for SU-8 photoresist

Time

Time interval

Sector exposure

Tool name:
Aligner DUV EVG
Area/room:
SB2 - Lithographie 2 (Aligneurs)
Category:
Lithography
Manufacturer:
EVG
Model:
620
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Instructors

Licensed Users

You must be logged in to view tool modes.