Picture of TEPLA Plasma O2
Current status:
AVAILABLE
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TECHNICAL SPECIFICATIONS

APPLICATIONS

Microwave source: 100 to 1000W

  • PR stripping
  • Surface activation

Gas : O2, CF4 and Ar

Resist stripping

Quartz holders for 25 wafers from 100mm to 150 mm and Aluminium shuttles (from pieces to 150 mm wafers)

End point detection : Intensity

Access: All trained users

 
Tool name:
TEPLA Plasma O2
Area/room:
SB2 - Gravure
Category:
Plasma etching
Manufacturer:
TEPLA
Model:
PVA TEPLA GIGABatch360M
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Instructors

Licensed Users

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