Picture of Vapor HF
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TECHNICAL SPECIFICATIONS :

Gas : HF, EtOH, N2

Recommended masking materials :  alumina, aluminum, silicon carbide, or silicon

No resists or polymers and no Kapton tape are allowed in the chamber as these will contaminate the chamber with polymer

Wafer size  : up to 6 inch

APPLICATIONS :

Hydrofluoric Acid Etcher is used primarily for isotropic etching of all types of SiO2 and offers a safer alternative to liquid-HF processes. Furthermore, the dry-HF process eliminates the stiction problems often encountered in releasing SOI-MEMS devices.

Tool name:
Vapor HF
Area/room:
SB2 - Gravure
Category:
Plasma etching
Manufacturer:
SPTS
Model:
PrimaxxuEtch
Max booking time, day:
hours
Max booking time, night:
hours
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