Pneumatic-controlled mechanical mini-press

Features:

• Two pneumatically-operated pistons (Piston 1 Fmax=1.4kN, Piston 2 Fmax=9.2kN)
• Force to be applied is adjusted individually for each piston by the pressure of compressed air
• Force is applied to the sample through ball-based mechanical setup
• Manual alignment of sample below the pistons

Applications:

• Chip-level bonding at high bonding pressure (orders of magnitude higher than available in wafer bonder)
• Room-temperature thermocompression bonding on chip-level (Au-Au)