TECHNICAL SPECIFICATIONS

APPLICATIONS

Resist thickness

Standard process: 5 µm

Other process: several tens of microns

Conformal resist coating on substrate with high topology

Resist dilution

Acetone, MEK

Parameters to adjust for the process

Dilution and solvent

Resist flow

Speed of the nozzle

Number of meanders

Chuck temperature

Nitrogen flow

Distance between nozzle and substrate

Nozzle

1 one dedicated for AZ10XT

Process time

5 minutes (for 5 µm)

Substrate size

100 mm - 150 mm & peaces of substrate