TECHNICAL SPECIFICATIONS

APPLICATIONS

FEATURES

Dedicated for removing particles from wafer surface by megasonic DI-water jet

Drying the wafers by IR heating and spinning

Vibratory motor and tilt applied to align wafers

Pre-bonding of wafers

Final rinsing of wafers before bonding  (reduction of particles)

WAFERS

Size of round wafers: 2”, 3", 4", 5”, 6”

Size of square substrates: 4”x4”, 5”x5”

Via-holes not allowed (vacuum chucks)

CHUCKS

Vacuum chucks

Spin speed: max.  4000 rpm

INSPECTION IR SYSTEM

Infra-Red inspection system for bonded Si stack

IR Camera, manually adjustable Optical Zoom

Field of view: max. Ø=75mm