TECHNICAL SPECIFICATIONS
APPLICATIONS
Features
Resolution 1µm
Files format : GDSII, CIF, DXF, GERBER
2 Writehead :
> HD with a precision of 0,1µm
(write time: 4" ⇒ 3h / 5" ⇒ 5h / 7"⇒ 10h)
> LD with a precision of 0,5µm
(write time: 4" ⇒ 40m / 5" ⇒ 1h / 7"⇒ 3h)
Optical masks, Direct exposure and 3D photolithography
Substrates
Mask soda lime 7*7*0,12
Mask Quartz 6*6*0.25
Mask soda lime 5*5*0.09
Mask soda lime 4*4*0.09
Wafer 4 and 3 inches
Chuck
Stage X/Y with vacuum
Optics
Laser He-Cd
wavelength 442nm
Power 180mW
Lifetime 3000 hours