TECHNICAL SPECIFICATIONS

APPLICATIONS

Features

Resolution 1µm

Files format : GDSII, CIF, DXF, GERBER

2 Writehead :

               > HD with a precision of 0,1µm

                    (write time: 4" ⇒ 3h / 5" ⇒  5h / 7"⇒ 10h)

               > LD with a precision of 0,5µm

                    (write time: 4" ⇒ 40m / 5" ⇒  1h / 7"⇒ 3h)

Optical masks, Direct exposure and 3D photolithography

Substrates

Mask soda lime 7*7*0,12

Mask Quartz 6*6*0.25

Mask soda lime 5*5*0.09

Mask soda lime 4*4*0.09

Wafer 4 and 3 inches

Chuck

Stage X/Y with vacuum

Optics

Laser He-Cd

wavelength 442nm

Power 180mW

Lifetime 3000 hours