MAIN FEATURES

APPLICATIONS

FUNCTIONS

- Automatic pick & place of die

- In-situ die-to-substrate alignment

- Bonding of die with excellent process control (heating/cooling rate, compression force, time)

Die to substrate bonding and interconnecting

OPERATION MODES

Bonding – Interconnecting, Hot embossing, Dispensing

Technical specifications

Size: 0.2-10mm (die) and 0.5-200mm (substrate)

Substrate chuck heating : 20°C up to 450°C