Picture of Flip-Chip bonder FC250
Current status:
AVAILABLE
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MAIN FEATURES

APPLICATIONS

FUNCTIONS

- Automatic pick & place of die

- In-situ die-to-substrate alignment

- Bonding of die with excellent process control (heating/cooling rate, compression force, time)

Die to substrate bonding and interconnecting

OPERATION MODES

Bonding – Interconnecting, Hot embossing, Dispensing

Technical specifications

Size: 0.2-10mm (die) and 0.5-200mm (substrate)

Substrate chuck heating : 20°C up to 450°C

Tool name:
Flip-Chip bonder FC250
Area/room:
SB1 - MEB / Flip-Chip
Category:
Packaging
Manufacturer:
Suss Microtec
Model:
FC250
Max booking time, day:
8 hours
Max booking time, night:
0 hours
No. of future bookings:

Instructors

Licensed Users

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