Picture of Pick and Place HB70
Current status:
AVAILABLE
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TECHNICAL SPECIFICATIONS

APPLICATIONS

DIE TOOL

Pick Up vacuum tools available:

H80-100 (Tip 100µm, Hole 50µm, Metal tip)

H80-500 (Tip 500µm, Hole 200µm, Plastic tip)

H80-1016  (Tip 1016µm, Hole 508µm, Plastic tip)

Force range: 1-100 cN

Motorized and Programmable Z-axis (25mm)

Die bonding, Assembly of micro- components

DIE CHUCK

Large stage (Ø=100mm) with mechanical/vacuum substrate fixation

Height range: 70-90 mm

Heating option: ambient to 250oC

Rotatable table with fine adjustment X, Y screws Option: Mechanical stage for miniature substrates

OPTICS

HDMI Camera 11x Optical and 125x Digital Zoom

LED illumination

Adjustable viewing angle

EPOXY

Stamping capillary (dot < 150µm, ceramic tip) 

Stamping tool (cross, dot ~1mm, metal tip)

Tool name:
Pick and Place HB70
Area/room:
SB1 - Caractérisation
Category:
Packaging
Manufacturer:
TPT
Model:
HB-70
Max booking time, day:
8 hours
Max booking time, night:
0 hours
No. of future bookings:

Instructors

Licensed Users

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