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Current status:
AVAILABLE
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TECHNICAL SPECIFICATIONS

APPLICATIONS

FEATURES

Measurement of the wafer curvature before and after film deposition

Stress range: 1 x 107 to 4 x 1010 dynes/cm2

Wafer sizes: 200mm or smaller

Laser: Dual wavelength (780nm, 650nm) diodes

Repeatability: 1.5 % (1σ) of average

Stress measurement of deposited thin films, Thermal expansion coefficients, Wafer bow height

SCAN AND MAPPING

Scan range: Up to 170mm

Scan line: Single scan line at any wafer orientation

Mapping: Multi scan line mapping by manually rotating wafers.

Max of 6 line mapping with 30° between each line

HEATING

Maximal temperature: 450°C

Heating and cooling ramps: max  6oC/min

Tool name:
FSM
Area/room:
SB1 - Caractérisation
Category:
Characterization
Manufacturer:
FSMG
Model:
500 TC
Max booking time, day:
8 hours
Max booking time, night:
0 hours
No. of future bookings:

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