TECHNICAL SPECIFICATIONS

APPLICATIONS

Features

Substrate & Wafers can be processed

Max size: diam. 8" / 4.3 mm thick

Axes precision: 1 µm (X, Y & Z) / 1.0’’ (θ)

Speed feed: 0.1 to 10 mm/s

Water cooling         

Separation &

Structuration of chips

Circle cut process

Holding

UV tape on porous vaccum chuck

Processed materials

Si, Glass, Quartz, LiNbO₃, LiTaO₃, PZT,

Si₃N₄, Langasite, Langatate, Sapphire

Blades

Resin, Metal or Vitrified bond