TECHNICAL SPECIFICATIONS
APPLICATIONS
Features
Substrate & Wafers can be processed
Max size: diam. 8" / 4.3 mm thick
Axes precision: 1 µm (X, Y & Z) / 1.0’’ (θ)
Speed feed: 0.1 to 10 mm/s
Water cooling
Separation &
Structuration of chips
Circle cut process
Holding
UV tape on porous vaccum chuck
Processed materials
Si, Glass, Quartz, LiNbO3, LiTaO3, PZT,
Si3N4, Langasite, Langatate, Sapphire
Blades
Resin, Metal or Vitrified bond