Picture of Scie DAD 3350
Current status:
AVAILABLE
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TECHNICAL SPECIFICATIONS

 

APPLICATIONS

 

Features

Substrate & Wafers can be processed

Max size: diam. 8" / 4.3 mm thick

Axes precision: 1 µm (X, Y & Z) / 1.0’’ (θ)

Speed feed: 0.1 to 10 mm/s

Water cooling         

Separation &

Structuration of chips


Circle cut process

Holding

UV tape on porous vaccum chuck

Processed materials

Si, Glass, Quartz, LiNbO3, LiTaO3, PZT,

Si3N4, Langasite, Langatate, Sapphire

Blades

Resin, Metal or Vitrified bond

Tool name:
Scie DAD 3350
Area/room:
Hors salle blanche
Category:
Dicing - Polishing
Manufacturer:
DISCO
Model:
DAD 3350
Max booking time, day:
8 hours
Max booking time, night:
0 hours
No. of future bookings:

Instructors

Licensed Users

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