TECHNICAL SPECIFICATIONS
APPLICATIONS
Features
Substrate & Wafers can be processed
Max size: diam. 4" / 4.3 mm thick
Axes precision: 1 µm (X, Y), 5 µm (Z) / 1.0’’ (θ)
Speed feed: 0.1 to 10 mm/s
Water cooling
Separation &
Structuration of chips
Holding
UV tape on porous vaccum chuck
Processed materials
Si, Glass, Quartz, LiNbO3, LiTaO3, PZT,
Si3N4, Langasite, Langatate, Sapphire
Blades
Resin, Metal or Vitrified bond