Picture of Scie DAD 321
Current status:
AVAILABLE
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2nd Responsible:
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TECHNICAL SPECIFICATIONS

 

APPLICATIONS

 

Features

Substrate & Wafers can be processed

Max size: diam. 4" / 4.3 mm thick

Axes precision: 1 µm (X, Y), 5 µm (Z) / 1.0’’ (θ)

Speed feed: 0.1 to 10 mm/s

Water cooling

Separation &

Structuration of chips

 

Holding

UV tape on porous vaccum chuck

Processed materials

Si, Glass, Quartz, LiNbO3, LiTaO3, PZT,

Si3N4, Langasite, Langatate, Sapphire

Blades

Resin, Metal or Vitrified bond

Tool name:
Scie DAD 321
Area/room:
Hors salle blanche
Category:
Dicing - Polishing
Manufacturer:
DISCO
Model:
DAD 321
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Instructors

Licensed Users

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