TECHNICAL SPECIFICATIONS

APPLICATIONS

Features

Substrate & Wafers can be processed

Max size: diam. 4" / 10 mm thickness

Min size: 10 mm²

Thickness precision: 1 µm

Speed: 1 to 100 rpm

Automatic flatness control & fix

Pressure of work adjusted with loads

Plate size: diam. 300 mm

Optical polishing

Material thinning

Holding

UV tape on vaccum chuck

Processed materials

Si, Glass, Quartz, LiNbO₃, LiTaO₃, PZT,

Si₃N₄, Langasite, Langatate, Stainless steel

Abrasives

Aluminium oxyde, Silicon Carbide, Diamond, Colloïdale Silica