TECHNICAL SPECIFICATIONS

APPLICATIONS

Features

2" to 6" wafers can be processed

Process program (10 steps)

Max thickness: 10 mm

Speed: 1 to 120 rpm

Hydraulic pressure of work

Plate size: diam. 465 mm

Wafer optical polishing

Hard materials process

Holding

Vaccum chuck

Processed materials

Si, Glass, Quartz, LiNbO₃, LiTaO₃, PZT,

Si₃N₄, Langasite, Langatate, Stainless steel

Abrasives

Colloïdale Silica, Diamond on different nozzle