Picture of CMP Alpsitec E460
Current status:
AVAILABLE
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TECHNICAL SPECIFICATIONS

 

APPLICATIONS

 

Features

2" to 6" wafers can be processed

Process program (10 steps)

Max thickness: 10 mm

Speed: 1 to 120 rpm

Hydraulic pressure of work

Plate size: diam. 465 mm

Wafer optical polishing

Hard materials process

 

Holding

Vaccum chuck

Ring (+ back pressure)
 

Processed materials

Si, Glass, Quartz, LiNbO3, LiTaO3, PZT,

Si3N4, Langasite, Langatate, Stainless steel

Abrasives

Colloïdale Silica, Diamond on different nozzle

Tool name:
CMP Alpsitec E460
Area/room:
Hors salle blanche
Category:
Dicing - Polishing
Manufacturer:
Alpsitec
Model:
E460
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Instructors

Licensed Users

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