Picture of DSM8
Current status:
AVAILABLE
Book | Log
Show/Collapse all

1st Responsible:
2nd Responsible:
You must be logged in to view files.

 TECHNICAL SPECIFICATIONS :

Substrate size : 4” & 6” circular wafers

Substrate thickness : from 200 µm to 1000 µm

Accuracy : 0.2 µm (3 s)

Measurement : Automatic measurement for multi points

Repeatability : 0.1 µm

Others : Tool induced shift compensation by wafer and pattern 180° rotation

                IR Metrology

Graphical User Interface : Including graphical display of results and ASCii output files (.CSV)

APPLICATIONS :

  • Top and bottom side alignment control
  • Top and top side alignment control
  • Top and infra-red alignment control for bonded wafers
  • Infra-red and infra-red alignment control for bonded wafers
Tool name:
DSM8
Area/room:
SB2 - Lithographie 2 (Aligneurs)
Category:
Lithography
Manufacturer:
Suss Microtec
Model:
DSM8 GEN2
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Instructors

Licensed Users

You must be logged in to view tool modes.