TECHNICAL SPECIFICATIONS

• Models : Spectral reflectance and Fast Fourier Transform
• Thickness : From 20 nm to 250 µm
• Wave-length range : 380 < λ < 1700 nm
• Wafer Chuck: Motorized rotation stage (f=100mm max) with vacuum substrate fixation
• Mapping: Custom map patterns (polar, rectangular, linear…)
• Acquisition speed : 2 points per second
• Spot size : 1.5 mm
• Filter : High-Pass Filter (λ > 550nm)

APPLICATIONS :

• Automated film thickness & index mapping
• Various refractive materials (photoresist, oxides, nitrides…)
• Stacked refractive materials
• Materials on various substrates