TECHNICAL SPECIFICATIONS

STAGES:

4”-6” wafer vacuum chuck

Motorized X/Y, motorized 360° rotation

STYLUS:

2 µm radius tip, 60° cone angle

Force: 0,03 to 15 mg

Safe mode for scratch-free measurements (resists, soft metals)

SCAN:

Direction: front to back

Minimum length: 50 µm

VERTICAL RESOLUTION:

Minimum step measurable: few nm

Maximum height: 1 mm

SOFTWARE:

Vision 64 operation and analysis software

Stitching

3D mapping

Stress measurement

Automation setup

APPLICATIONS :

• Step height measurement
• Roughness measurement
• Surface topography
• 3D mapping
• Thin film stress measurement