TECHNICAL SPECIFICATIONS

APPLICATIONS

Resist thickness

Standard process: 5 µm

Other process: several tens of microns

Conformal resist coating on substrate with high topology

Resist dilution

Acetone, MEK

Parameters to adjust for the process

Dilution and solvent

Resist flow

Speed of the nozzle

Number of meanders

Chuck temperature

Nitrogen pressure

Distance between nozzle and substrate

Nozzles

2 (one dedicated for S1813)

Process time

5 minutes (for 5 µm)

Substrate size

4” max