Picture of Wafer surface measurement Vantage 2
Current status:
AVAILABLE
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TECHNICAL SPECIFICATIONS

 

APPLICATIONS

 

Features

Substrate & Wafers can be processed

Max size: 200 mm / 40 mm thickness

Max measurement range: 10 mm

X & Y resolution: 50 nm

Bow & Warp precision: +/- 0.2 µm
Bow & Warp resolution: 40 nm

TTV & Thickness precision:
1889 µm thick sample: 1.75 µm
200 µm thick sample: 175 nm

TTV & Thickness resolution:
1889 µm thick sample: 175 nm
200 µm thick sample: 17,5 nm

Acquisition speed: 4000 pts/sec

SCAN CT software - Various filters and measurements

Surface measurement

Thickness measurement

Optical profilometry

 

Optics

Infrared interferometer

Confocal white light sensor

Holding

Holding pins (no vaacum)

Processed materials

Si, Glass, Quartz, LiNbO3, LiTaO3, Sapphire.

Tool name:
Wafer surface measurement Vantage 2
Area/room:
SB1 - Caractérisation
Category:
Characterization
Manufacturer:
Accelonix
Model:
Cybertechnologies Vantage 2
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Instructors

Licensed Users

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