Picture of Aligner Double Side EVG
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AVAILABLE
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TECHNICAL SPECIFICATIONS

APPLICATIONS

Resolution

Vacuum ≤ 0.8 µm

Hard Contact ≤ 1.5 µm

Soft Contact ≤ 2.0 µm

Proximity ≥ 5.0 µm

Top and bottom side alignments, Alignment for bonding

 

 

Alignment stage

Manual precision micrometers

Alignment accuracy

Top side alignment: ± 1.0µm

Bottom side alignment: ± 1.25µm

Substrate size

2”, 3” and 4”

Thickness: 0.1 to 2.5 mm (more on demand)

Mask size

4” and 5”

Mask design

GDSII file: utile.gds (to be downloaded from the clean room website)

Exposure

Broadband (mercury arc lamp: 350 W)

Long pass filter for SU-8 photoresist

Time

Time interval

Sector exposure

Tool name:
Aligner Double Side EVG
Area/room:
SB2 - Lithographie 2 (Aligneurs)
Category:
Lithography
Manufacturer:
EVG
Model:
620
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Instructors

Licensed Users

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